Photoresist hardbake (Shipley 1813) |
|---|
|
| Ambient Ambient to which substrate is exposed during processing |
air |
|---|
| Batch size |
25 |
|---|
| Excluded materials |
gold (category), copper |
|---|
| Loading effects Free form text field for description of loading effects (e.g. bullseye) |
none |
|---|
| Material |
Shipley 1813 |
|---|
| Pressure Pressure of process chamber during processing |
1 atm |
|---|
| Sides processed |
both |
|---|
| Temperature |
115 °C |
|---|
| Thermal duration |
60 min |
|---|
| Wafer size |
|
|---|
| Equipment |
Blue M CC04-C-P-B |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
stainless steel |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon dioxide, alumina |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1000 µm |
|---|
| Extra terms |
Customer agrees that wafers, masks, and other materials
incorporating any process(es) provided by this fabrication site
are to be used solely for non-commercial research
purposes.
|
MEMS and Nanotechnology Exchange