on front DUV develop (Shipley UV210) |
|---|
|
| Developer Agent that reacts with masking layer (e.g., photoresist) to etch it selectively. |
LDD 26W |
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| Material |
Shipley UV210 |
|---|
| Selectivity Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials) |
Shipley UV210: 1 |
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| Setup time |
30 min |
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| Sides processed |
either |
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| Temperature |
23 °C |
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| Wafer size |
|
|---|
| Equipment |
SVG 8800 Photoresist coat and develop track |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 800 µm |
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MEMS and Nanotechnology Exchange