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Chip encapsulation: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

Chip encapsulation
Process characteristics:
Encapsulation material
Specify preferred epoxy encapsulation material (if known).
Encapsulation material
Specify preferred epoxy encapsulation material (if known).
Equipment