Photoresist develop (Shipley 1827): View

Photoresist develop (Shipley 1827)

Batch size

Developer

Agent that reacts with masking layer (e.g., photoresist) to etch it selectively.

MF-319

Material

Shipley 1827

Selectivity

Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)

Shipley 1827: 1

Sides processed

both

Temperature

25 °C

Wafer size

Equipment

Wet etch bench

Equipment characteristics:

Piece dimension

Range of wafer piece dimensions the equipment can accept

1 .. 150 mm

Piece geometry

Geometry of wafer pieces the equipment can accept

rectangular

Piece thickness

Range of wafer piece thickness the equipment can accept

200 .. 1000 µm

Wafer geometry

Types of wafers this equipment can accept

1-flat, 2-flat

Wafer holder

Device that holds the wafers during processing.

teflon boat, teflon carrier

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

quartz (fused silica), Pyrex (Corning 7740), silicon on insulator, silicon, ceramic

Wafer thickness

List or range of wafer thicknesses the tool can accept

200 .. 1000 µm

Comments:

Exposed photoresist.