Photoresist coat (AZ 9260): View

on front Photoresist coat (AZ 9260)

Process characteristics:

Thickness

Amount of material added to a wafer

5 .. 10 µm

Batch size

Excluded materials

gold (category), copper

Material

AZ 9260

Sides processed

either

Wafer size

Equipment

Solitec 5110-C

Equipment characteristics:

Wafer holder

Device that holds the wafers during processing.

teflon

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon, silicon dioxide, alumina

Wafer thickness

List or range of wafer thicknesses the tool can accept

300 .. 1000 µm

Extra terms

Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.