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Selective polishing: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
   CMP
   Lapping
   Miscellaneous polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

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Selective polishing
Process characteristics:
Materials
Specify material(s) to be selectively removed by polishing.
Materials
Available  
Selected
Specify material(s) to be selectively removed by polishing.
Remaining material
Specify material to remain during polishing.
Remaining material
Specify material to remain during polishing.
Roughness
Required RMS roughness of the polished surface (if known).
Roughness
Required RMS roughness of the polished surface (if known).
unconstrained
Thickness removed
Thickness of material to be removed.
Thickness removed
Thickness of material to be removed.
unconstrained
Sides processed either
Equipment
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