on front Photoresist softbake |
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|
| Material |
photoresist (category) |
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| Setup time |
30 min |
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| Sides processed |
either |
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| Temperature |
90 °C |
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| Wafer size |
|
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| Equipment |
SVG 8600 Photoresist Coat Track |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
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| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 700 µm |
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MEMS and Nanotechnology Exchange