Megasonic clean: View

Megasonic clean

Wafer size

Equipment

Note that 150 mm wafer is not cleaned completely in this tool. The megasonic head does not go to the wafer edge, so only about 80% of the wafer is cleaned from the center out.

Equipment characteristics:

Wafer geometry

Types of wafers this equipment can accept

1-flat, 2-flat, no-flat

Wafer holder

Device that holds the wafers during processing.

teflon carrier

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

quartz (single crystal), silicon on insulator, Pyrex (Corning 7740), silicon

Wafer thickness

List or range of wafer thicknesses the tool can accept

100 .. 3000 µm

Comments:

Note that 150 mm wafer is not cleaned completely in this tool. The megasonic head does not go to the wafer edge, so only about 80% of the wafer is cleaned from the center out.