Surface fly-cutting: View

on front Surface fly-cutting

Process characteristics:

Thickness removed

Amount of material removed

0 .. 500 µm

Material

photoresist (category)

Sides processed

either

Wafer size

Equipment

Equipment characteristics:

Wafer geometry

Types of wafers this equipment can accept

no-flat, 1-flat, 2-flat, notched

Wafer holder

Device that holds the wafers during processing.

aluminum chuck

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon

Wafer thickness

List or range of wafer thicknesses the tool can accept

300 .. 1500 µm

Comments:

Used to trim the thickness of organic layers such as SU-8 and PMMA.
Precision: +/- 10um.