logo
Residual stress measurement: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
   Electrical metrology
   Geometric metrology
   Miscellaneous metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

on front
Residual stress measurement
Process characteristics:
Thickness
Thickness of film on which the stress is measured.
Thickness
Thickness of film on which the stress is measured.
unconstrained
Sides inspected
The sides of the wafer inspected by the process
either
Equipment