Thermocompression bonding |
|---|
|
| Process characteristics: |
| 1st bonded material Specify first material in bonded pair. |
|
|---|
| 2nd bonded material Specify second material in bonded pair. |
|
|---|
| Alignment tolerance Tolerance of alignment if needed.
|
|
|---|
| Alignment type Method used to align materials to be bonded. |
|
|---|
| Ambient Preferred bonding environment (if known).
|
|
|---|
| Bond strength Required strength of bond (if known). |
|
|---|
| Contact force Preferred contact force applied when bonding materials (if known). |
|
|---|
| Temperature Preferred bonding temperature (if known).
|
|
|---|
| Equipment |
|
MEMS and Nanotechnology Exchange