|
|
| Batch size |
1 |
|---|
| Pressure Pressure of process chamber during processing |
1 atm |
|---|
| Sides processed |
both |
|---|
| Temperature |
90 °C |
|---|
| Thermal duration |
30 min |
|---|
| Wafer size |
|
|---|
| Equipment |
Oven |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
wafer boat |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
quartz (single crystal), silicon on insulator, silicon, Pyrex (Corning 7740) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 2000 µm |
|---|
| Comments: |
|
MEMS and Nanotechnology Exchange