DUV photoresist hardbake: View

DUV photoresist hardbake

Material

Shipley UV210

Process duration

120 min

Setup time

30 min

Sides processed

both

Temperature

120 °C

Wafer size

Equipment

Equipment characteristics:

Wafer geometry

Types of wafers this equipment can accept

1-flat, 2-flat

Wafer holder

Device that holds the wafers during processing.

teflon cassette

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon

Wafer thickness

List or range of wafer thicknesses the tool can accept

300 .. 700 µm