Piranha clean II (non-MOS clean) |
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|
| Batch size |
24 |
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| Material concentrations |
sulfuric acid/hydrogen peroxide [98:2] |
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| Process duration |
10 min |
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| Setup time |
30 min |
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| Sides processed |
both |
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| Temperature |
120 °C |
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| Wafer size |
|
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| Equipment |
VLSI sink 8 |
| Equipment characteristics: |
| MOS clean |
no |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
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| Wafer holder Device that holds the wafers during processing. |
teflon cassette |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon, glass (category) |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 600 µm |
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| Comments: |
|
MEMS and Nanotechnology Exchange