Photoresist Blue M Pre- & Post-Bake |
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| Process characteristics: |
| Temperature 95...150 |
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| Excluded materials |
gold |
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| Material |
photoresist (category) |
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| Wafer size |
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| Equipment |
Blue M Bake Oven |
| Equipment characteristics: |
| Batch sizes |
100 mm: 4, 150 mm: 3, 50 mm: 4, 75 mm: 4 |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer holder Device that holds the wafers during processing. |
stainless steel |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
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| Comments: |
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MEMS and Nanotechnology Exchange