Spectroscopic ellipsometry film thickness measurement: View

on front Spectroscopic ellipsometry film thickness measurement

Batch size

Materials

silicon dioxide, silicon nitride

Process duration

15 min

Sides processed

either

Thickness

0.01 .. 5 µm

Wafer size

Equipment

Equipment characteristics:

Wafer holder

Device that holds the wafers during processing.

vacuum chuck

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon

Wafer thickness

List or range of wafer thicknesses the tool can accept

200 .. 1000 µm

Comments:

Other substrates such as gallium arsenide and glass may be used. However, the values of N and K for the desired substrate should be provided.