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| Process characteristics: |
| 1st bonded material Specify first material in bonded pair. |
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| 2nd bonded material Specify second material in bonded pair. |
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| Alignment tolerance Preferred tolerance if alignment is required. |
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| Alignment type Method used to align materials to be bonded. |
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| Ambient Preferred curing environment (if known). |
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| Bond strength Required strength of bond (if known). |
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| Contact force Preferred force to be applied when bonding materials (if known). |
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| Temperature Preferred curing temperature for adhesive (if known). |
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| Equipment |
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| Comments: |
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