on front Wafer curvature measurement |
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|
| Batch size |
1 |
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| Excluded materials |
gold (category), copper |
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| Measurement unit |
MPa |
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| Sides processed |
either |
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| Wafer size |
|
|---|
| Equipment |
FSM 3800 |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
stainless steel |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
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| Extra terms |
Customer agrees that wafers, masks, and other materials
incorporating any process(es) provided by this fabrication site
are to be used solely for non-commercial research
purposes.
|
MEMS and Nanotechnology Exchange