on front HMDS prime (manual) |
|---|
|
| Batch size |
1 |
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| Material |
HMDS |
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| Pressure Pressure of process chamber during processing |
1 atm |
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| Sides processed |
either |
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| Temperature |
25 °C |
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| Wafer size |
|
|---|
| Equipment |
Solitec 5100 |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category) |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
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| Comments: |
|
MEMS and Nanotechnology Exchange