PMMA resist sheet bonding |
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| Alignment type Method used to align materials to be bonded. |
unaligned |
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| Wafer size |
|
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| Equipment |
Wetbench |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
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| Wafer holder Device that holds the wafers during processing. |
teflon carrier |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1500 µm |
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| Comments: |
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MEMS and Nanotechnology Exchange