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| Batch size |
25 |
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| Process duration |
25 min |
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| Sides processed |
both |
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| Temperature |
110 °C |
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| Thermal duration |
25 min |
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| Wafer size |
|
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| Equipment |
Post-exposure bake oven |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
cassette |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category), quartz (single crystal), gallium arsenide, silicon on insulator, silicon on sapphire |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
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| Comments: |
|
MEMS and Nanotechnology Exchange