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| Process characteristics: |
| 1st bonded material Specify first material in bonded pair. |
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| 2nd bonded material Specify second material in bonded pair.
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| Alignment tolerance Tolerance of alignment if needed.
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| Alignment type Method used to align materials to be bonded. |
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| Ambient Preferred bonding environment (if known). |
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| Bond strength Required strength of bond (if known).
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| Contact force Preferred contact force applied when bonding materials (if known). |
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| Temperature Preferred bonding temperature (if known).
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| Equipment |
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MEMS and Nanotechnology Exchange