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| Process characteristics: |
| 1st bonded material Specify first material in bonded pair. |
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| 2nd bonded material Specify second material in bonded pair. |
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| Alignment tolerance Tolerance of alignment if needed.
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| Alignment type Method used to align materials to be bonded. |
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| Ambient Preferred environment for curing of resist (if known). |
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| Bond strength Required strength of bond (if known). |
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| Contact force Preferred contact force applied when bonding materials (if known). |
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| Material Specify preferred photoresist bonding material (if known). |
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| Temperature Preferred curing temperature for photoresist (if known). |
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| Equipment |
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| Comments: |
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MEMS and Nanotechnology Exchange