Maskless printing: View

MEMS and Nanotechnology Exchange

Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Contact mask lithography
Maskless lithography
Miscellaneous lithography
Projection mask lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
DUV Lithography
Deep boron diffusion
Hot Embossing
LIGA
Maskless lithography
Microwave bonding
Shape memory alloy deposition
Silicon-germanium processes
Supercritical dry
Xenon difluoride etch

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

on front Maskless printing

Process characteristics:

Min feature size

Dimension of smallest feature to be resolved in the lithography.

unconstrained

Sides processed

either

Equipment