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Chemical polishing: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
   CMP
   Lapping
   Miscellaneous polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

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Chemical polishing
Process characteristics:
Materials
Specify material(s) to polish.
Materials
Available  
Selected
Specify material(s) to polish.
Roughness
Required RMS roughness of the polished surface (if known).
Roughness
Required RMS roughness of the polished surface (if known).
unconstrained
Sides processed
Specify whether polishing is to occur on a single or both sides of substrate.
Sides processed
Specify whether polishing is to occur on a single or both sides of substrate.
Thickness removed
Thickness of material to be removed.
Thickness removed
Thickness of material to be removed.
unconstrained
Equipment
Comments:
  • The substrate is placed in a chemical solution, which etches the surface to reduce the surface roughness.
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