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| Process characteristics: |
| 1st bonded material Specify bond pad material for first end of bond wire. |
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| 2nd bonded material Specify bond pad material for second end of bond wire. |
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| Ambient Preferred adhesive curing environment (if known). |
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| Bond strength Required strength of wire bond (if known). |
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| Min bond pad size Minimum characteristic dimension of bond pad. |
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| Min bond pad spacing Minimum spacing between bond pads. |
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| Number of bond wires Total number of wires to be bonded. |
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| Temperature Preferred curing temperature for adhesive (if known). |
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| Wire material Bond wire material. |
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| Equipment |
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MEMS and Nanotechnology Exchange