Die attach: View

MEMS and Nanotechnology Exchange

Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

Die attach

Process characteristics:

1st bonded material

Material of die to be bonded.

1st bonded material

Material of die to be bonded.

2nd bonded material

Material of substrate for die to be bonded to.

2nd bonded material

Material of substrate for die to be bonded to.

Ambient

Preferred adhesive curing environment (if known).

Bond strength

Required strength of die bond (if known).

unconstrained

Encapsulation material

Specify preferred epoxy die attach material (if known).

Encapsulation material

Specify preferred epoxy die attach material (if known).

Temperature

Preferred curing temperature for die attach adhesive (if known).

unconstrained

Equipment