on front Contact front-front align & expose |
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|
| Alignment side |
front |
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| Alignment tolerance Registration of CAD data to features on wafer |
1 µm |
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| Batch size |
1 |
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| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
line |
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| Field geometry Shape of field with dimensions characterized by the maximum field size |
circle |
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| Max field size |
100 mm |
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| Min feature size |
1 µm |
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| Sides processed |
either |
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| Wafer size |
|
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| Equipment |
EV420 mask aligner |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
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| Comments: |
|
MEMS and Nanotechnology Exchange