Contact sheet resistivity measurement: View

on front Contact sheet resistivity measurement

Batch size

Current

10 mA

Measurement aspect

sheet resistivity

Measurement unit

Ohm/sq

Sheet resistance

0.0011 .. 450000 Ω/square

Sides processed

either

Temperature

25 °C

Wafer size

Equipment

Equipment characteristics:

MOS clean

Wafer holder

Device that holds the wafers during processing.

plastic chuck

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

gallium arsenide, indium phosphide, silicon

Wafer thickness

List or range of wafer thicknesses the tool can accept

200 .. 550 µm

Comments:

Sheet resistance measured at center, top, bottom, left, right areas of wafers or at specified locations. Different measurement patterns will require repricing.
Equipment can measure 4 different values: sheet resistivity, slice resistivity, V/I, and metallized thickness. Can also be used to determine doping type for substrate (p/n).
Sheet resistivity range = 1.1e-3 to 4.5e+5 ohm/sq
Slice resistivity range = 4.19e-2 mohm-cm to 17.1 kohm-cm
V/I range = 0.25mohm to 99.9kohm
metallized thickness = 20A to 243kA