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| Process characteristics: |
| Ambient Preferred bonding environment (if known).
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| Bonding force Preferred contact force applied when bonding materials (if known).
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| Curing temperature Preferred curing temperature for underfilling material (if known). |
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| Encapsulation material Specify preferred epoxy underfilling material (if known). |
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| Min bond pad size Minimum characteristic dimension of bond pad. |
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| Min bond pad spacing Minimum spacing between bond pads. |
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| Temperature Preferred bonding temperature (if known). |
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| Equipment |
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MEMS and Nanotechnology Exchange