on front Epoxy coat (SU-8) |
|---|
|
| Process characteristics: |
| Thickness |
|
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| Material |
SU-8 |
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| Min feature size |
1 .. 50 µm |
|---|
| Photoresist polarity |
negative |
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| Sides processed |
either |
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| Temperature |
25 °C |
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| Wafer size |
|
|---|
| Equipment |
Headway spinner |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1, 150 mm: 1, 200 mm: 1, 75 mm: 1 |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
|---|
| Comments: |
|
MEMS and Nanotechnology Exchange