Photoresist strip (non-metal): View

Photoresist strip (non-metal)

Batch size

Etchant

Solutions and their concentrations.

sulfuric acid/hydrogen peroxide

Material

photoresist (category)

Process duration

40 min

Selectivity

Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)

photoresist (category): 1

Sides processed

both

Temperature

120 °C

Wafer size

Equipment

Nonmetal wet bench

Equipment characteristics:

Wafer holder

Device that holds the wafers during processing.

teflon chuck

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon, glass (category), quartz (single crystal), sapphire, silicon on insulator, silicon on sapphire

Wafer thickness

List or range of wafer thicknesses the tool can accept

300 .. 550 µm

Comments:

Doesn't etch silicon, silicon dioxide, silicon nitride, or silicon on insulator.