EDX (Energy Dispersive Spectrometry): View

MEMS and Nanotechnology Exchange

Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Electrical metrology
Geometric metrology
Miscellaneous metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

on front EDX (Energy Dispersive Spectrometry)

Process characteristics:

Materials

Material(s) expected to be found on the surface of the sample.

Materials

Available

Material(s) expected to be found on the surface of the sample.

Thickness

Thickness of the top material layer on the sample.

unconstrained

Sides inspected

The sides of the wafer inspected by the process

either

Equipment