on front Sheet resistance measurement |
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|
| Batch size |
1 |
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| Current |
1e-06 .. 0.2 A |
|---|
| Materials |
metal (category), silicon (doped) |
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| Process duration |
5 min |
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| Sheet resistance |
0.005 .. 5e+06 Ω/square |
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| Sides processed |
either |
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| Voltage |
1e-06 .. 1 V |
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| Wafer size |
|
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| Equipment |
OmniMap Prometrix |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
conductive platen |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 600 µm |
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MEMS and Nanotechnology Exchange