logo
Register or Sign in

Photoresist coat (Shipley 3612): View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
   Evaporation
   LPCVD
   Low-stress SiN deposition
   Miscellaneous deposition
   Oxidation
   PECVD
   Spin casting
   Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

on front
Photoresist coat (Shipley 3612)
Process characteristics:
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer
Batch size 25
Material Shipley 3612
Process duration 100 min
Sides processed either
Temperature 90 °C
Wafer size
Wafer size
Equipment SVG Autocoater 8626
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
 vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, glass (category), quartz (single crystal), silicon on sapphire, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 550 µm
Comments:
  • Requires dehydration bake prior to coat
  Contact us    Search    Comment on this page